Tokyo - Toshiba Corporation today announced the launch of "TC35670FTG", which is a support for low-power (LE) Bluetooth low-power communications and near field communication (NFC) Type3 dual function of IC tags (IC) (Bluetooth?). Sample Shipment starts immediately. A growing number of Bluetooth Smart [2] provides a low-power Bluetooth devices compatibility. Toshiba's new IC are low-power Bluetooth IC series, and provides two key features: Bluetooth and NFC tags feature pairing ease; long standby button battery-powered devices. The IC will promote the popularity of low-power Bluetooth communications technology on small devices, such as wearable health devices, sensors, toys, as well as the most compelling start next touch smartphone accessories. Earlier, the equipment manufacturers to design supports Bluetooth and NFC tag two communication systems must be separately integrated IC for Bluetooth and NFC tags. Toshiba's new approach provides a design that helps to minimize the number of components, reduce 30% of the assembly area, and shorten development time. NFC has a label component for storing data 1.5KB E2PROM, device manufacturers can use low-power Bluetooth and NFC tags to access, to connect to each diode NXP I2C interface, so that each system can easily handle the data. Several methods of integrated circuits in the circuit overhaul NXP sensor ICs often need to be removed from the printed circuit board, but also because of more intensive IC pins, disassemble it very difficult, and sometimes damage integrated circuits and circuit boards. 1, suction tin tin suction method uses suction tin demolition demolition blocks, which is a common professional approach, using the tool for the general aspiration, electric soldering iron NXP two transistors, power 35W or more. When removing the manifold, as long as two electric heated tip on manifold pin to be removed until melted tin solder is sucked inside the thin tin, after all suction manifold that solder pins can be removed. 2, medical hollow needle demolition method to take medical No. 8-12 several hollow needles. Use needle Neijing just caught manifold pin appropriate. When removing the pin with a soldering iron to melt the solder, promptly caught with a needle pin, then removed the iron and rotate the needle, such as solder solidified after pull out the needle. So that the pin is completely separate and PCB. All pins to do so again, the manifold can be easily removed. L78M10ABDT-TR NXP transistor, 耀坤 Technology (certified), supplied by NXP Nanjing Nanjing 耀坤 Technology Limited. Nanjing Yaokun Ltd. (www.njykkj.com) is Nanjing, diodes leaders, over the years, the company is implementing the scientific management, innovation and development, the principle of honesty and trustworthiness, and satisfy customer needs. In Yaokun technology leadership with the staff warmly welcome all inquiries negotiations to create a better future Yaokun technology.